RK3568 O2O smart terminal board manufacturer Pro for New Zealand Buyers - Wholesale O2O Smart Device

From September 17, 2026, the WF-RK3568-SD130 from Wanlin Group (Shenzhen, China) is available to New Zealand buyers under the factory's 2026 O2O Smart Device and Terminal Android Boards export program, Rockchip RK3568 quad-core SoC, 8GB LPDDR4X, 16GB eMMC + Hardware 4K@60fps H.265 / H.264 / VP9 decode, Android 12 / Android 13: O2O Smart Device and Terminal Android Boards, WF-RK3568-SD130, 8GB LPDDR4X + 16GB eMMC, with O2O smart device and online-to-offline terminal programmes, configured to the needs of O2O Smart Device and Terminal Android Boards. Wanlin Group as the O2O Smart Device and Terminal Android Boards supplier, exporter and original manufacturer now serves local partners, regional exclusive distributors and strategic OEM clients in more than 60 destination markets, and the O2O Smart Device and Terminal Android Boards program is open to New Zealand buyers ordering at factory-direct terms.

Core parameters: Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU. CPU 4x ARM Cortex-A55 @ 2.0 GHz, 64-bit. GPU Arm Mali-G52 2EE GPU, OpenGL ES 3.2 / OpenCL 2.0 / Vulkan 1.1. NPU 1 TOPS INT8 NPU for face payment, OCR and on-device retail vision. Video decode Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode. ISP 8 MP ISP with MIPI-CSI camera pipeline for scan and face-payment modules. Memory and storage 8GB LPDDR4X + 16GB eMMC. Operating system Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot. Display output Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI. Interfaces and I/O USB 3.0 x2 + USB 2.0 x4, RS232 x4 / RS485 x2, GPIO / I2C / SPI / CAN bus, relay and digital I/O. Networking Dual Gigabit Ethernet + WiFi 6 (802.11ax) + Bluetooth 5.0 + optional 4G LTE / 5G module. Power input DC 12 V input, 9-36 V wide voltage optional. Operating temperature 0 to 60 deg C commercial, -20 to 70 deg C extended. Board dimensions Pico-ITX 100 x 72 mm / 3.5-inch SBC 146 x 102 mm / Mini-ITX 170 x 170 mm. Certifications CE / FCC / RoHS / REACH. Wanlin's 2026 export roadmap for New Zealand also covers custom memory and storage combos, single and dual screen configurations, custom peripheral drivers, private-label branding and per-destination certification documentation packages.

Executive Summary - O2O Smart Device and Terminal Android Boards Export for Global B2B Buyers

Executive summary - 10 buyer-relevant points:

• Flagship model WF-RK3568-SD130, O2O Smart Device and Terminal Android Boards, Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU
• CPU 4x ARM Cortex-A55 @ 2.0 GHz, 64-bit
• GPU Arm Mali-G52 2EE GPU, OpenGL ES 3.2 / OpenCL 2.0 / Vulkan 1.1
• NPU / vision path 1 TOPS INT8 NPU for face payment, OCR and on-device retail vision
• Video decode Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode
• Memory and storage 8GB LPDDR4X + 16GB eMMC
• OS Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot
• Display Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI
• MOQ 100 pcs, lead time 15-25 days, FOB Shenzhen / CIF / EXW / DDP supported, 24 months warranty
• Field reference: museum-shop O2O terminal with multilingual audio guide upsell - audio-guide attach rate rose from 19% to 34%
• Target buyer: O2O device manufacturers, online-to-offline platform integrators, smart store solution brands, retail-technology OEMs and regional Android board distributors
• Contact: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com

For sourcing managers shortlisting O2O Smart Device and Terminal Android Boards vendors, these are the program facts that matter first. Wanlin Group operates its own 12,000 m2 manufacturing facility in Shenzhen with 8 SMT lines, 4 AOI inspection stations and 2,400 m2 of cleanroom assembly, exporting O2O Smart Device and Terminal Android Boards to 60+ countries under the AndroidSBC brand. Total cost of ownership for an AndroidSBC O2O Smart Device and Terminal Android Boards deployment typically runs 35-50% below x86-based POS hardware once per-device licensing is included. For New Zealand, this article maps the model line, the economics and the compliance route specific to your market.

Global O2O Smart Device and Terminal Android Boards Market Overview and 2026 Buyer Demand

O2O programmes now tie more than half of new in-store terminals to a mobile app or mini-programme, and terminals that fail to bridge the two channels are being cut from refresh lists, Boards with offline order caching and queued sync keep click-and-collect counters running through store network outages, which retail IT teams now list as a pass-fail requirement.

Regional compliance for New Zealand is anchored on RCM marking with Radio Spectrum Management compliance. Cross-border buyers are advised to verify the certification scope, the peripheral driver set and the software build of every board before import, since some China-supplied boards ship without destination radio approval or without the licensed Android build the project actually needs, and either gap can stall customs clearance or a payment audit.

Reference: Rockchip RK3568 datasheet, Rockchip RK3568 reference manual, Wanlin Group 2026 O2O smart device hardware export program documentation, O2O and self-service deployment records 2024-2026.

O2O Smart Device and Terminal Android Boards Engineering Architecture and Hardware Platform

The O2O Smart Device and Terminal Android Boards family is engineered on three pillars: (1) a Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU compute block with 1 TOPS INT8 NPU for face payment, OCR and on-device retail vision; (2) a display, camera and peripheral pipeline built around Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode; (3) a software layer pairing Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot with kiosk-mode management, OTA tooling and the RKNN Toolkit2 and RKNPU2 SDK. This architecture delivers continuous retail duty at a cost point that undercuts x86 POS hardware while keeping the peripheral driver coverage and fleet tooling integrators expect.

Three sub-modules define the engineering depth:

• Compute module - Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU. 4x ARM Cortex-A55 @ 2.0 GHz, 64-bit handles sustained transaction, UI and on-device inference workloads in fanless kiosk enclosures.
• Display and camera module - Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI. Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode drives single or dual screens, and the camera path serves scan, age-verification and face-payment modules.
• Peripheral and management module - USB 3.0 x2 + USB 2.0 x4, RS232 x4 / RS485 x2, GPIO / I2C / SPI / CAN bus, relay and digital I/O. Headless operation is supported for lockers and vending, and the toolchain covers RKNN Toolkit2 and RKNPU2 SDK, OTA upgrade, boot logo customization, pre-installed app support and launcher customization for remote fleet management.

Featured Model - WF-RK3568-SD130 Pro Technical Signature

The featured model is WF-RK3568-SD130, part of the O2O Smart Device and Terminal Android Boards family, configured in this batch with 8GB LPDDR4X memory and 16GB eMMC storage. FOB Shenzhen reference price is $131.00 per piece at MOQ 100 pcs, with bulk tier pricing from $113.97 to $144.10 depending on memory and storage combination, regional certification and packaging artwork. Lead time is 15-25 days from PO confirmation and 30% T/T deposit receipt, with a 24-month warranty.

The technical signature of WF-RK3568-SD130 on this configuration is documented below. Every parameter is verified by our Shenzhen lab against the panel specifications of mainstream LCD vendors, the electrical limits of IEC / UL 62368-1 and the serial timing requirements of common retail peripherals.

Specification	Value
soc_platform	Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU
cpu_core	4x ARM Cortex-A55 @ 2.0 GHz, 64-bit
gpu_3d	Arm Mali-G52 2EE GPU, OpenGL ES 3.2 / OpenCL 2.0 / Vulkan 1.1
ai_vision	1 TOPS INT8 NPU for face payment, OCR and on-device retail vision
video_decode	Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode
camera_isp	8 MP ISP with MIPI-CSI camera pipeline for scan and face-payment modules
memory_storage	8GB LPDDR4X + 16GB eMMC
os_android	Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot
display_out	Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI
retail_io	USB 3.0 x2 + USB 2.0 x4, RS232 x4 / RS485 x2, GPIO / I2C / SPI / CAN bus, relay and digital I/O
networking	Dual Gigabit Ethernet + WiFi 6 (802.11ax) + Bluetooth 5.0 + optional 4G LTE / 5G module
power_input	DC 12 V input, 9-36 V wide voltage optional
operating_temp	0 to 60 deg C commercial, -20 to 70 deg C extended
board_dimension	Pico-ITX 100 x 72 mm / 3.5-inch SBC 146 x 102 mm / Mini-ITX 170 x 170 mm
certifications	CE / FCC / RoHS / REACH
use_case	O2O smart device and online-to-offline terminal programmes

O2O Smart Device and Terminal Android Boards Application Scenarios across Deployment Sites

The scenarios below are drawn from actual O2O Smart Device and Terminal Android Boards deployment records, with site, fleet size and quantified results for each.

Scenario 1: museum-shop O2O terminal with multilingual audio guide upsell (Vienna, Austria). A museum operator ran terminals pairing a 21.5-inch landscape panel with an audio amplifier and a barcode scanner, letting visitors collect app-bought tickets and add audio guides in six languages at the shop counter. Measured result: audio-guide attach rate rose from 19% to 34% and ticket-desk queues shrank by half.

Scenario 2: O2O fitting-room call terminal in a fashion store (Lyon, France). A fashion retailer replaced paper fitting-room tags with terminals carrying an RFID reader and a 10.1-inch touch panel, letting shoppers request sizes from the app or the shelf tag and routing staff by floor. Measured result: size-request response time fell from 6.2 to 2.3 minutes and fitting-room conversion rose 12%.

Scenario 3: multilingual O2O terminal for a DIY chain (Hamburg, Germany). A home-improvement chain specified one Android image that switches between German, Turkish, Polish and English at the language selector, driving a 21.5-inch panel with a scale on RS232 and a label printer for click-and-collect parcels. Measured result: language-switch faults fell to 0.2% of sessions and collect-desk throughput rose 33%.

Scenario 4: tourist-facing O2O terminal in a historic-centre pharmacy (Milan, Italy). A pharmacy group near the duomo deployed terminals with an ID scanner, a fiscal printer on serial and a launcher switching between Italian, English and Chinese, reconciling app pre-orders with counter dispensing. Measured result: tourist prescription handling time fell 46% and fiscal document rejects fell from 3.8% to 0.4%.

Scenario 5: O2O terminal with Klarna-style staged payment handoff (Stockholm, Sweden). A specialty retailer required terminals to complete app-reserved purchases at the counter with an NFC reader, a receipt printer and a signature pad, queueing payment confirmations for replay if the acquirer link drops. Measured result: payment confirmations failed on 0.1% of transactions and counter dwell time fell from 74 s to 31 s.

AndroidSBC O2O Smart Device and Terminal Android Boards Competitive Advantages for Cross-Border Buyers

The O2O Smart Device and Terminal Android Boards and the wider AndroidSBC O2O smart device portfolio deliver eight advantages for cross-border B2B buyers sourcing from Chinese manufacturers:

1. Source-factory pricing - Wanlin operates the SMT lines, so FOB Shenzhen pricing runs 35-50% below western-branded x86 POS hardware with no per-device licence fee.
2. Peripheral driver coverage - printers, scanners, scales, drawers, hoppers, note acceptors, RFID, NFC and card readers ship with tested drivers, because one unsupported device stalls a whole lane.
3. Single and dual screen output - Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI, including independent framebuffers so advertising or customer content never stalls the transaction process.
4. Retail-grade I/O - USB 3.0 x2 + USB 2.0 x4, RS232 x4 / RS485 x2, GPIO / I2C / SPI / CAN bus, relay and digital I/O, covering serial peripherals, mechanism control and wide-voltage power for unattended sites.
5. Multi-OS flexibility - Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot, so app-driven O2O projects and Linux-based locker or vending controllers run on one board.
6. Custom memory and storage - 2GB-8GB LPDDR4 / LPDDR4X and 16GB-128GB eMMC, matching image size and workload to the deployment instead of paying for capacity the lane never uses.
7. ODM depth - carrier board redesign, extra serial channels, custom connector maps, peripheral driver development, AOSP or Linux builds and private-label packaging from one factory.
8. Continuous-duty reliability - hardware watchdog, RTC, scheduled power on and off, auto-reboot after power failure and 7x24 unattended operation for lockers, vending and off-grid sites.

Combined, these advantages let AndroidSBC partners win lane retrofit tenders, kiosk programmes, vending and locker deployments and private-label retail projects, secure regional distribution rights, and serve end customers under their own brand at a landed cost 35-45% below legacy suppliers.

O2O Smart Device and Terminal Android Boards Certifications, Standards Route and Regional Compliance

The WF-RK3568-SD130 carries the following certifications as standard scope: CE / FCC / RoHS / REACH. Optional add-on documentation available on request includes UKCA, KC, PSE, SAA, RCM and EAC packs, country-specific declaration templates and UL 62368-1 test reports. All boards are produced in an ISO 9001:2015 and ISO 14001:2015 certified factory with RoHS and REACH declarations issued per batch.

Cross-border buyers should note that retail hardware compliance combines product marking, radio certification, safety evaluation and - for food-contact, weighing or payment functions - additional local evidence. For New Zealand specifically, importers should confirm RCM marking with Radio Spectrum Management compliance before shipment. Wanlin provides a pre-validated compliance package per model with DoC templates, test report copies and label artwork, reducing importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets.

O2O Smart Device and Terminal Android Boards Economics, MOQ, Lead Time and Logistics Math

For a first-time buyer ordering 1,000 pieces of the WF-RK3568-SD130, the economics stack is:

Cost Layer	USD per piece	USD for 1000 pcs
FOB Shenzhen factory price	$131.00	$131000.00
+ Sea freight FCL 40HQ (estimated)	$3.40	$3400.00
CIF destination port	$134.40	$134400.00
+ Customs duty 3%-10% (region dependent)	$0.84	$842.84
+ Local delivery + warehousing	$5.60	$5600.00
DDP landed cost	$140.84	$140840.00

Sample order cost is USD 60 per SKU refundable against the first bulk order above MOQ. 30% T/T deposit and 70% balance against B/L copy is the standard payment term; L/C at sight is accepted for orders above USD 80,000. Production lead time is 15-25 days, warranty is 24 months, and free DOA replacement applies within 60 days of receipt.

O2O Smart Device and Terminal Android Boards FAQ - OEM, ODM, MOQ, Lead Time, Partnership

Below are eight frequently asked questions from cross-border buyers sourcing O2O Smart Device and Terminal Android Boards from China. Each answer is anchored on Wanlin's commercial terms, certification scope and field experience across 60+ export markets under the AndroidSBC brand.

What is the difference between OEM and ODM for O2O Smart Device and Terminal Android Boards?

Answer: OEM (Original Equipment Manufacturer) means Wanlin Group builds the O2O terminal board, smart device controller or finished O2O terminal under your brand with your PCB silk-screen, logo, packaging and SKU. ODM (Original Design Manufacturer) means we redesign the carrier board, memory and storage combination, I/O set, peripheral drivers, firmware or enclosure around your project. Both run from the same Shenzhen factory and the same firmware team: OEM lead time is 15-25 days and ODM 30-45 days including pre-compliance checks. Schematic review, custom carrier layout, AOSP or Linux build work, peripheral driver development and certification support are provided under NDA.

Which O2O smart device board should I source for my application?

Answer: Eight selection rules for cross-border buyers:

• (1) O2O smart device terminals and click-and-collect counters: WF-RK3568-SD120 / SD140 with a 15.6-inch main panel, order caching, scanner on USB and order-slip printer on RS232.
• (2) Self-service check-in, ticketing and registration kiosks: WF-RK3568-SV120 / SV150 with an ID scanner, contactless reader and offline queue continuity.
• (3) Smart vending machines and unattended coolers: WF-RK3568-VM140 / VM160 with MDB or RS485 mechanism control, per-slot relay output and 4G telemetry.
• (4) Parcel, food, medicine and battery-swap lockers: WF-RK3568-LK130 / LK140 with 16-160 relay-controlled doors, QR and PIN access and signed door-event logs.
• (5) Digital signage players and media player boxes: WF-RK3568-SG110 / SG120 with 4K hardware decode, offline playlist caching and emergency override.
• (6) Retail and restaurant O2O counters: WF-RK3568-RR120 / RR140 with fiscal-printer profiles, scale on RS232 and app-loyalty integration.
• (7) Dual-screen and multi-display terminals: WF-RK3568-DU150 / DU170 with independent framebuffers, per-screen rotation and per-screen state restore.
• (8) Private-label and fully custom programmes: WF-RK3568-OD170 / OD180 with custom carrier board, custom firmware and branded packaging.

What software support comes with the boards?

Answer: Every board ships with Android images alongside Linux support (Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot), BSP source access, driver documentation, SDK material and OTA tooling. The Android builds ship with GMS / Play Store where the destination market and product category qualify; for markets or projects that do not need Google services, the same hardware runs a full AOSP or Linux build, which also lowers unit cost. Kiosk-mode launchers, auto-start app configuration, scheduled power on and off, remote configuration and cloud CMS agents are part of the standard integration work. The AI path uses RKNN Toolkit2 and RKNPU2 SDK for face payment, OCR and item recognition where the project needs on-device inference.

How do Wanlin O2O smart device boards compare with x86 POS PCs and legacy Windows terminals?

Answer: Because Wanlin builds the boards rather than reselling them, landed cost typically runs 35-50% below western-branded x86 POS PCs and 20-30% below legacy Windows CE or proprietary terminals on equivalent peripheral support. On the engineering side, this configuration brings Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU, 4x ARM Cortex-A55 @ 2.0 GHz, 64-bit and Arm Mali-G52 2EE GPU, OpenGL ES 3.2 / OpenCL 2.0 / Vulkan 1.1, with the BSP covering Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot. Licensing cost also disappears: legacy Windows terminals carry per-device licence fees and security patch cycles, while the Android build carries none. Where a project needs certified Google services with Play Store, the GMS option closes the software gap at the same hardware cost.

Can the board drive two screens and the full retail peripheral set?

Answer: Yes. Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI. The peripheral stack covers thermal printers and fiscal printers on RS232, barcode scanners on USB or serial, cash drawers on relay outputs, weighing scales on RS232, coin hoppers and note acceptors on serial, RFID readers on USB, card readers and NFC on USB, fingerprint and face-payment modules on USB or MIPI-CSI, and mechanism control on RS485, MDB or CAN bus. Drivers ship with the image; if a peripheral is not yet in our driver library, our firmware team writes and validates the driver as part of the ODM scope.

What are the MOQ, lead time, trade terms, sample policy and warranty?

Answer: MOQ is 100 pcs per model. Lead time is 15-25 days for standard configurations and 30-45 days for ODM customization. Trade terms are FOB Shenzhen, CIF by sea or air, EXW factory and DDP door-to-door. Payment is 30% T/T deposit with 70% balance against the B/L copy; L/C at sight is accepted above USD 80,000. Samples ship in 1-3 days via DHL Express at USD 60 per SKU, refundable against the first bulk order. Warranty is 24 months, with free DOA replacement within 60 days of receipt.

Which certifications do the boards carry and what is included for importers?

Answer: Boards ship with CE / FCC / RoHS / REACH declarations per batch from an ISO 9001:2015 and ISO 14001:2015 certified factory. UKCA, KC, PSE, SAA, RCM, EAC and UL 62368-1 report documentation is available on request, and RCM marking with Radio Spectrum Management compliance. We provide DoC templates, test report copies, label artwork and a pre-validated compliance package per model, which shortens importer certification lead time from a typical 2-3 months to 1-2 weeks for most markets. For payment terminals we also provide a PCI DSS scope note describing what the board does and does not process.

What customization and partnership options does Wanlin offer?

Answer: Customization scope:

1. (1) Branding - custom PCB silk-screen, private-label logo on board and enclosure, custom SKU, packaging and boot animation.
2. (2) Firmware - custom launcher, kiosk lock-down, pre-installed apps, fiscal receipt templates, custom boot logo and OTA channel.
3. (3) Hardware - carrier board redesign, extra serial channels, custom connector maps, memory and storage combinations (2GB-8GB LPDDR4 / LPDDR4X, 16GB-128GB eMMC), single or dual screen output, 4G / 5G module options and CAN bus expansion.
4. (4) Software - AOSP build service, Linux BSP porting, peripheral driver development, SDK modules, OTA server setup and on-device model conversion for face payment and item recognition.
5. (5) Delivery - DDP shipping, FBA or overseas-warehouse labelling, per-batch MAC and serial provisioning.

Partnership tiers: Authorized Reseller (list price), Regional Distributor (20%% off, single-country exclusivity) and Strategic OEM Partner (30%% off, multi-country exclusivity, dedicated engineering team).

Wanlin Global Partner Stories - Real Project References

Four buyer references from 2024-2026 follow, anonymized per agreement, with city, application scene and measured outcomes.

The table below is anonymized by agreement but every row carries a real city, application and quantified outcome from 2024-2026.

City	Application	Outcome
Monterrey, Mexico	O2O boards surviving unstable mains	an operator facing brownouts specified auto power-on after loss, a watchdog on the launcher and a super-capacitor-backed RTC so terminals recover unattended overnight.
Porto, Portugal	one image across three O2O formats	an integrator runs the same board image on pickup counters, fitting-room panels and collection lockers across 140 sites, holding a single spare-part SKU and one OTA channel.
Vancouver, Canada	private-label O2O terminal board for a loyalty-platform brand	a loyalty-platform vendor private-labels the board with custom silk-screen, a branded boot animation and per-store MAC provisioning on a 3,600 unit quarterly repeat order under NDA.
Tel Aviv, Israel	terminal board hardened for hot storefronts	a retail group specified extended-temperature boards with a scheduled power profile for glass-front kiosks that reach 55 deg C at noon; units have run two summers without a field failure.

Partnership Models - Authorized Reseller, Regional Distributor, Strategic OEM

Wanlin offers three partnership tiers for cross-border buyers of O2O Smart Device and Terminal Android Boards:

• Authorized Reseller - annual volume USD 20,000+, list price, no exclusivity, standard 24-month warranty, dedicated account manager with a response within 4 business hours.
• Regional Distributor - annual volume USD 80,000+, 20% off list, single-country exclusivity, co-marketing budget, joint certification cost-share, free BSP and firmware updates for the life of the product.
• Strategic OEM Partner - annual volume USD 250,000+, 30% off list, multi-country exclusivity, dedicated engineering team, joint roadmap, 18-month price lock and one joint trade-show booth per year at EuroCIS, NRF Retail, CES, Canton Fair or the Hong Kong Electronics Fair in Hong Kong, China on a cost-share basis.

All partners receive free certification documentation and test report copies, custom Android image support, free DOA replacement within 60 days, per-batch MAC and serial provisioning, and a sample programme with USD 60 per SKU refundable against the first bulk order above MOQ.

Conclusion - How to Start Your O2O Smart Device and Terminal Android Boards Sourcing Today

Wanlin Group's 2026 O2O Smart Device and Terminal Android Boards export program is open to B2B buyers, regional distributors, cross-border traders and OEM/ODM partners in New Zealand and 60+ destination markets. To start a sourcing discussion, request a quotation or schedule a factory audit in Shenzhen, contact the export team below. Sample orders ship within 1-3 days via DHL Express for in-stock SKUs; custom-configuration samples require 7-15 days. Standard lead time for bulk OEM orders is 15-25 days, and Strategic OEM Partner applications are reviewed quarterly.

We invite New Zealand buyers, export traders and trading companies to build long-term cooperation with Wanlin Group as your China-based OEM/ODM partner, regional exclusive distributor or strategic global supplier under the AndroidSBC brand. Wanlin is the manufacturer behind 60+ country O2O board projects, the SMT lines and aging rooms behind every batch, and this export program. Let's build the O2O Smart Device and Terminal Android Boards supply chain together.

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Model: WF-RK3568-SD130
Platform: Rockchip RK3568 quad-core SoC, 22 nm process, integrated 1 TOPS NPU
CPU: 4x ARM Cortex-A55 @ 2.0 GHz, 64-bit
GPU: Arm Mali-G52 2EE GPU, OpenGL ES 3.2 / OpenCL 2.0 / Vulkan 1.1
NPU / vision: 1 TOPS INT8 NPU for face payment, OCR and on-device retail vision
Video: Hardware 4K@60fps H.265 / H.264 / VP9 decode, 1080p60 H.264 encode
Camera ISP: 8 MP ISP with MIPI-CSI camera pipeline for scan and face-payment modules
Memory: 8GB LPDDR4X
Storage: 16GB eMMC
OS: Android 12 / Android 13, Linux (Ubuntu 22.04) and Buildroot
Display: Dual independent display via LVDS + eDP + HDMI 2.0 + MIPI-DSI, up to 4K@60 on HDMI
Network: Dual Gigabit Ethernet + WiFi 6 (802.11ax) + Bluetooth 5.0 + optional 4G LTE / 5G module
Retail I/O: USB 3.0 x2 + USB 2.0 x4, RS232 x4 / RS485 x2, GPIO / I2C / SPI / CAN bus, relay and digital I/O
Power: DC 12 V input, 9-36 V wide voltage optional
Temperature: 0 to 60 deg C commercial, -20 to 70 deg C extended
Cert: CE / FCC / RoHS / REACH
MOQ / Lead / Warranty: 100 pcs / 15-25 days / 24 months
FOB Shenzhen reference price: $131.00 per piece at MOQ 100 pcs
Region: New Zealand
Contact: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com

• Wanlin Group, Building B, Building 1, Beisida Medical Device Building, 28 Nantong Avenue, Baolong Community, Baolong Sub-district, Longgang District, Shenzhen, Guangdong, China
• Manufacturer: Wanlin Group / Brand: AndroidSBC / Site: www.androidsbc.com
• Export service: Email: Androidsbc@163.com | Phone: +8613261677119 | Website: https://www.androidsbc.com
• Form factor: O2O Smart Device and Terminal Android Boards / Chip: Rockchip RK3568 / Platform: Rockchip RK3568 quad-core SoC
• Country compliance for New Zealand: RCM marking with Radio Spectrum Management compliance